24-Station Spin Coater Barrier Coating | Edge Bead Reduction & Anti-Contamination for Semiconductor Lines

جزئیات محصول:

محل منبع: چین
نام تجاری: OSMANUV
گواهی: ISO9001
شماره مدل: مشخصات

پرداخت:

مقدار حداقل تعداد سفارش: 1 مجموعه
قیمت: قابل مذاکره
جزئیات بسته بندی: بسته بندی چوب
زمان تحویل: 30-45 روز
شرایط پرداخت: T/T
قابلیت ارائه: مذاکره
بهترین قیمت مخاطب

اطلاعات تکمیلی

برند اینورتر: اشنایدر بسته بندی: جعبه چوبی استاندارد
روش تغذیه: پایین، سمت اختیاری است ایستگاه کار: 24
عرض محصول حداکثر: 500 میلی متر نسخه: 2.0
بعد: به عنوان نیاز مشتری نام تجاری فرکانس: شیلین یا اشنایدر

توضیحات محصول

24-Station Spin Coater Barrier Coating | Edge Bead Reduction & Anti-Contamination for Semiconductor Lines
This 24-station spin coater barrier coating is formulated to form a sacrificial or permanent isolation layer on substrates before main coating (photoresist, polyimide, or dielectric). It prevents cross-contamination, reduces edge bead formation, and protects spin chucks from solvent attack. Customizable solid content, solvent system, and stripping method available for different wafer sizes (2″-12″) and device layers.
Technical Parameters
Parameter Value / Range
Solid Content 2% - 25% (customizable)
Viscosity (cP @25°C) 3 - 150 (adjustable)
Density (g/cm³) 0.85 - 1.10
Spin speed range 500 - 6000 rpm (24 stations synchronized)
Film thickness (after spin) 0.1 - 5.0 μm (tunable)
Drying temperature 80 - 200°C (hotplate or oven)
Drying time 30 - 180 sec
Metal ion content (Na, K, Fe) < 10 ppb each (high-purity grade)
Particle count (≥0.2 μm) < 30 / mL
Stripping method Solvent strip (NMP, PGMEA) or thermal decomposition
Applications
  • Semiconductor wafer processing (front-end & back-end)
  • MEMS & sensor manufacturing
  • Compound semiconductor (GaN, SiC) spin coating
  • LED phosphor & protective layer
  • R & D spin coaters with 24-position capability
  • Custom substrates (glass, sapphire, metal, polymer films)
Customization
We offer full customization for 24-station spin coaters:
  • Solvent system (PGMEA, cyclohexanone, anisole, water-based)
  • Stripping method (wet strip, ashing, or leave-on permanent)
  • Edge bead reduction effect (customizable receding contact angle)
  • Wafer size compatibility (2", 4", 6", 8", 12")
  • Batch volume from 500mL (R&D) to 20L (production)
  • Low-metal & low-particle grades available per customer spec
Features
  • ✅ Prevents resist contamination on spin chuck and cover cup
  • ✅ Reduces edge bead height by 60-80%
  • ✅ Compatible with automated dispensing & EBR systems
  • ✅ No post-coating residue after proper stripping
  • ✅ Heat-stable up to 200°C (no outgassing)
  • ✅ Low defect density (<0.05 defects/cm²)
  • ✅ Can be used as sacrificial layer for lift-off processes
Support and Services
  • Process optimization for your 24-station spin coater (speed/acceleration/ramping)
  • Free residue test on your wafer type
  • On-site or remote installation support
  • Custom formula development within 15 working days
  • Material safety datasheet (SDS) + processing guide
  • 24/7 technical support for production lines
Packing and Shipping
  • Standard packing: 1L, 4L, 20L HDPE bottles (double-bagged)
  • Custom packing: 200L drum, 1000L IBC, or sealed syringe cartridges for automated dispensing
  • Shipping: Cleanroom-packed, Class 3 flammable (if solvent-based) or non-dangerous (water-based)
  • Lead time: 5 days for stock, 12-18 days for custom batches
  • Storage: 6-12 months @15-25°C in original sealed container
Frequently Asked Questions
Q1: Can this barrier coating be used on all 24-station spin coaters?
A: Yes. The fluid is customizable for different nozzle types (static, linear scan, or spray) and spin chuck designs (vacuum or mechanical). Provide your coater model for optimization.
Q2: Is it permanent or removable?
A: Both. Standard version is strippable (solvent or ash). Permanent version available for protective layer applications.
Q3: Will it affect photoresist adhesion?
A: No. The barrier coating is designed to be either fully removed or to have matched surface energy. Adhesion tests can be provided.

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